| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2026 | 02 | WO/2026/006978 | THERMALLY CONDUCTIVE COMPOSITION, THERMALLY CONDUCTIVE GEL, AND USE THEREOF | CN2024/103073 | C08L 83/06 | HENKEL AG & CO. KGAA | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/007059 | THERMALLY CONDUCTIVE SILICONE COMPOSITION | CN2024/103552 | C08L 83/07 | HENKEL AG & CO. KGAA | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/007108 | ONE-PART (1K) MS/EPOXY HYBRID CURABLE COMPOSITION, PREPARATION METHOD AND USE OF THE SAME | CN2024/103882 | C08L 71/00 | HENKEL AG & CO. KGAA | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/007231 | LASER-WELDABLE REINFORCED LONG-CARBON-CHAIN NYLON MATERIAL AND PREPARATION METHOD THEREFOR | CN2024/118440 | C08L 77/06 | SHANDONG DONGCHEN RUISEN NEW MATERIAL TECHNOLOGY CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/007360 | EPOXY RESIN MOLDING MATERIAL FOR C-MOLD PROCESS AND PREPARATION METHOD THEREFOR AND USE THEREOF | CN2024/142473 | C08L 63/00 | SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/007463 | POLYMER COMPOSITION, POLYMER FILM, HOLOGRAPHIC GRATING AND MANUFACTURING METHOD THEREFOR, OPTICAL FILM, AND DISPLAY DEVICE | CN2025/083313 | C08L 31/04 | HUAWEI TECHNOLOGIES CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/008334 | SPRAY DRYING PROCESS OF BIOSURFACTANTS | EP2025/067075 | C08L 5/00 | EVONIK OPERATIONS GMBH | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/008734 | POLYMER COMPOSITION FOR CABLE INSULATION | EP2025/068893 | C08L 23/12 | BOREALIS GMBH | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/008753 | POLYPROPYLENE COMPOSITION | EP2025/068925 | C08L 23/12 | SABIC GLOBAL TECHNOLOGIES B.V. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/008754 | POLYPROPYLENE COMPOSITION | EP2025/068926 | C08L 23/12 | SABIC GLOBAL TECHNOLOGIES B.V. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009240 | AGE RESISTANT LOW DENSITY PEROXIDE CURED EPDM RUBBER BASED INSULATION WITHOUT LIQUID EPDM AND ITS USE THEREOF IN COMPOSITE ROCKET MOTOR CASING | IN2025/050958 | C08L 23/16 | CHAIRMAN, DEFENCE RESEARCH & DEVELOPMENT ORGANISATION (DRDO) | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009507 | THERMOPLASTIC RESIN COMPOSITION, MOLDED BODY, METHOD FOR PRODUCING THERMOPLASTIC RESIN COMPOSITION, AND METHOD FOR PRODUCING MOLDED BODY | JP2025/012450 | C08L 101/00 | DIC CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009726 | THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | JP2025/022253 | C08L 69/00 | TECHNO-UMG CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009766 | RUBBER MATERIAL FOR TIRE AND TIRE | JP2025/022635 | C08L 21/00 | TOKUYAMA CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009778 | EPOXY RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | JP2025/022785 | C08L 63/00 | NAMICS CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009780 | EPOXY RESIN COMPOSITION, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | JP2025/022787 | C08L 63/00 | NAMICS CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009807 | VINYL CHLORIDE-BASED RESIN COMPOSITION, STABILIZER COMPOSITION, MODIFIER, AND MOLDED BODY | JP2025/023014 | C08L 27/06 | ADEKA CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009828 | RUBBER COMPOSITION FOR TIRE AND TIRE | JP2025/023197 | C08L 9/06 | THE YOKOHAMA RUBBER CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009851 | RUBBER COMPOSITION FOR TIRE, AND TIRE | JP2025/023337 | C08L 9/06 | THE YOKOHAMA RUBBER CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009901 | LOW DIELECTRIC HEAT-DISSIPATING MATERIAL | JP2025/023753 | C08L 25/00 | DENKA COMPANY LIMITED | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009906 | 3,4,5,6-TETRAHYDROPHTHALIC ACID METAL SALT, CRYSTAL NUCLEATING AGENT FOR POLYOLEFIN-BASED RESIN, POLYOLEFIN-BASED RESIN COMPOSITION, AND POLYOLEFIN-BASED RESIN MOLDED BODY | JP2025/023765 | C08L 23/00 | NEW JAPAN CHEMICAL CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009930 | COMPOSITION, SURFACE TREATMENT AGENT, ARTICLE, METHOD FOR PRODUCING ARTICLE, AND COMPOUND | JP2025/023866 | C08L 83/06 | AGC INC. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009941 | RESIN COMPOSITION, CURING METHOD THEREFOR, AND CURED BODY | JP2025/023924 | C08L 45/00 | DENKA COMPANY LIMITED | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/009975 | MOLDING MATERIAL, METHOD FOR PRODUCING MOLDING MATERIAL, MOLDED BODY, AND LIGHTING FIXTURE FOR VEHICLE | JP2025/024171 | C08L 33/10 | KURARAY CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010047 | THERMOPLASTIC FLAME-RETARDANT RESIN COMPOSITION AND MOLDED ARTICLE | KR2024/096660 | C08L 53/00 | LG CHEM, LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010048 | PHASE CHANGE THERMOSETTING RESIN, PREPARATION METHOD THEREFOR, AND HEAT DISSIPATION COMPOSITE COMPRISING SAME | KR2024/096786 | C08L 63/00 | CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010314 | POLYETHYLENE COMPOSITION AND STRETCHED FILM COMPRISING SAME | KR2025/009312 | C08L 23/0807 | LG CHEM, LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010330 | BIODEGRADABLE FOAMING COMPOSITION, BIODEGRADABLE FOAM USING SAME, AND FOAMED MOLDED BODY | KR2025/009348 | C08L 67/04 | DONGSUNG CHEMICAL CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010359 | THERMOSETTING INSULATING RESIN AND INSULATING FILM USING SAME | KR2025/009425 | C08L 63/00 | HANWHA E-SSENTIAL CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010386 | BIODEGRADABLE POLYESTER RESIN COMPOSITION AND BIODEGRADABLE MOLDED PRODUCT COMPRISING SAME | KR2025/009482 | C08L 67/02 | SK LEAVEO CO., LTD. | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010481 | POLYOLEFIN RESIN COMPOSITION AND MOLDED ARTICLE PRODUCED THEREFROM | KR2025/095443 | C08L 23/14 | LOTTE CHEMICAL CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010761 | RHEOLOGY MODIFIED ETHYLENE/ALPHA-OLEFIN/NONCONJUGATED POLYENE INTERPOLYMERS USING SULFUR SOURCES | US2025/034910 | C08L 23/16 | DOW GLOBAL TECHNOLOGIES LLC | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010767 | RHEOLOGY MODIFIED ETHYLENE/ALPHA-OLEFIN/NONCONJUGATED POLYENE INTERPOLYMERS USING HYDROSILYLATION AGENTS | US2025/034960 | C08L 23/16 | DOW GLOBAL TECHNOLOGIES LLC | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010800 | CURABLE SILICONE COMPOSITION, CURED PRODUCT AND COMPOSITE | US2025/035434 | C08L 83/04 | DOW SILICONES CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010801 | CURABLE SILICONE COMPOSITION, CURED PRODUCT AND COMPOSITE | US2025/035436 | C08L 83/04 | DOW SILICONES CORPORATION | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی | 2026 | 02 | WO/2026/010951 | BIOBASED EPOXY RESINS | US2025/036086 | C08L 63/00 | SWIMC LLC | CHEMISTRY; METALLURGY | علم شیمی؛ متالورژی | شیمی |